Introduction: the ultra-thin wafer is flexible, fragile, easy to warp and undulation, so the device wafer is usually bonded to a thicker carrier with intermediate material first, and then through back thinning and TSV After the fabrication of hole process, rewiring layer and internal interconnection, the external energy (light, electricity, heat and external force) is input to make the bonding layer fail, and then the device wafer is separated from the carrier. This process is the temporary bonding process of wafer. The bonding adhesive used to fix the thin wafer is the key to the success of the temporary bonding process.